Nanostructured Externally Cure-Initiated
Thermally and Electrically Conductive Adhesives--Nanosonic, Inc., P.O. Box 618, Christiansburg, VA
24068-0618; 540-953-1785
Dr. Jeffrey Mecham, Principal Investigator, jbmecham@nanosonic.com
Dr. Richard O. Claus, Business Official, roclaus@nanosonic.com
DOE Grant No. DE-FG02-01ER83223
Amount: $99,999
Prior
research has identified novel electron transport percolation effects in
nanostructured thin films and structural epoxy adhesives that incorporate noble
metal nanoclusters. Due to the
ultrasmall size of the clusters, the onset of percolation can be controlled.
Furthermore, the nanostructured nature of the adhesive also allows unique
opportunities for the implementation of cure mechanisms initiated by external
field excitation. This project will
develop nanostructured, externally cure-initiated, and, potentially,
electrically- and thermally-conductive adhesives for use in the fabrication of
detectors used in nuclear physics. Phase
I will demonstrate the feasibility of such cure initiation by external means,
and also investigate the fundamental nature of electrical and thermal
conductivity properties that may be useful for specialized adhesive bonding and
packaging applications.
Commercial
Applications and Other Benefits as described by awardee: Externally cure-initiated
nanostructured adhesives, including those with combined electrical and thermal
conductivities, would enable the rapid practical assembly of electronic and
structural components for detectors and other systems.
Additional applications include uses as an electrically-conductive and
thermally-conductive adhesive for chip-to-substrate bonding and thermal
management, the low-cost electrical connection of materials used in electronic
enclosures, and the bonding of precisely positioned materials where UV
initiation is not practical.